Computer memory is divided into two main types: DDR3 and DDR4. The former is older, having debuted back in 2007, while the latter only hit the mainstream recently, with Intel's X99 platform in 2014. The speed it has to offer depends on the specific chip that is installed. To check the speed, look under the Memory graph and you will see a dedicated Speed field telling you what your RAM’s speed is. You cannot change DDR3 into DDR4 through driver updates or by doubling your RAM. The DDR4 features a 288-pin nodule instead of the 240-pin module observed in the DDR3. As a result, the DDR4 cannot fit into a slot designed for the DDR3. If you decide to upgrade to DDR4 RAM, it is important to keep this in mind because it means you must upgrade your motherboard.

A SO-DIMM, SODIMM, or small outline dual in-line memory module, is a type of computer memory built using integrated circuits. SO-DIMMs are a smaller alternative to a DIMM, being roughly half the size of regular DIMMs.

SO-DIMMs are often used in systems that have limited space, which include laptops, notebooks, small-footprint personal computers such as those based on Mini-ITXmotherboards, high-end upgradable office printers, and networking hardware such as routers and NAS devices.^[2]

• 1Visual identification

Visual identification[edit]

Most types of SO-DIMMs can be recognized visually by the distinctive notches that “key” them for different applications:^[1]

• 100-pin SO-DIMMs (SDR SDRAM) have two notches.^[3]
• 144-pin SO-DIMMs (SDR SDRAM) have a single notch near the center.^[4]
• 200-pin SO-DIMMs (DDR SDRAM or DDR2 SDRAM) have a single notch nearer to one side.^[5] The exact location of this notch varies (read below).
• 204-pin SO-DIMMs (DDR3 SDRAM) have a single notch closer to the center than on 200-pin SO-DIMMs.^[6]
• 260-pin SO-DIMMs (DDR4 SDRAM), 69.6 mm (2.74 inches) wide and 30 mm (1.2 inches) high, making them 2 mm (0.079 inches) wider than DDR3 SO-DIMMs, with a single notch after pin 144.^[7]
• 260-pin SO-DIMMs (UniDIMM), 69.6 mm (2.74 inches) wide and 30 mm (1.2 inches) or 20 mm (0.79 inches) high, with a single notch placed differently than on DDR3 SO-DIMMs.^[8][9]

Variants of 200-pin SO-DIMMs[edit]

The 200-pin SO-DIMM can be of the types DDR and DDR2. In both cases the notch is located at one fifth of the board length (20 pins + notch + 80 pins), but in DDR2 the notch is located slightly closer to the center of the board. These two types of memory are not interchangeable. The different notch locations are designed to prevent cross-installation, aiding at the same time in visually identifying 200-pin SO-DIMM modules.^[1]

This variance is designed to prevent coupling of memory and controllers of different DDR generations due to electrical incompatibility. DDR SO-DIMMs operate at 2.5 V while DDR2 SO-DIMMs operate at 1.8 V.^[10]

Variants of DDR3 SO-DIMMs[edit]

These modules, while using the same physical layout, may differ in the specified voltage - 1.5 or 1.35 volts. The lower voltage modules are sometimes, but not always, identified as DDR3L - see also DDR3 SDRAM.

General characteristics[edit]

200-pin and 204-pin SO-DIMMs are 67.6 mm (2.66 inches) long, 31.75 mm (1.250 inches) wide, having a maximum total depth of 3.8 mm (0.15 inches).^[11]

SO-DIMMs are nearly equal in power and voltage rating to DIMMs; SO-DIMM technology does not mean lower performance compared to larger DIMMs. For example, DDR3 SO-DIMMs provide clock speeds such as 533 MHz (1066 MT/s, PC3-8500), CAS latencies such as 7, and higher capacities such as 4 GB per module.^[12]

DDR2 SO-DIMM memory modules commonly have clock speeds from 200 MHz upward (specifications). 204-pin SO-DIMMs can also contain DDR3 SDRAM, with specifications such as PC3-6400, PC3-8500, PC3-10600, PC3-14900 and PC3-17000.^[13] 260-pin UniDIMMs contain DDR3 or DDR4 SDRAM depending on configuration. Some SO-DIMMs provide ECC functionality; unbuffered ECC SO-DIMMs are called SO-CDIMMs.^[14]

See also[edit]

• Dual in-line package (DIP)
• Memory geometry – logical configuration of RAM modules (channels, ranks, banks, etc.)
• Rambus in-line memory module (RIMM)
• Single in-line memory module (SIMM)
• Single in-line package (SIP)
• Zig-zag in-line package (ZIP)

References[edit]

1. ^ ^abc'Are DDR, DDR2 and DDR3 SO-DIMM memory modules interchangeable?'. acer.custhelp.com. Retrieved 2015-06-26.
2. ^Synology Inc. 'Synology RAM Module'. synology.com.
3. ^'RAMCHECK 100-Pin DDR Adapter, a tool for testing and identifying JEDEC-compliant 100-pin DDR SO-DIMM modules'. memorytesters.com. 2013. Retrieved 2015-06-26.
4. ^'Small-outline SDRAM module (MT16LSDF3264(L)H 256 MB and MT16LSDF6464(L)H 512 MB) Datasheet'(PDF). Micron Technology. 2006-05-03. p. 22. Retrieved 2015-06-26.
5. ^'DDR DIMM & SODIMM Modules (184-pin DDR DIMM, 100-pin DDR DIMM, and 200-pin DDR SO-DIMM modules)'(PDF). smartm.com. 2011. p. 4. Retrieved 2015-06-26.
6. ^'NT2GC64B(C)H4B0PS / NT4GC64B(C)88B0(1)NS / NT8GC64B(C)8HB0NS PC3(L)-10600 / PC3(L)-12800 Unbuffered DDR3 SO-DIMM'(PDF). nanya.com. December 2012. p. 23. Retrieved 2015-06-26.
7. ^'DDR4 SDRAM SO-DIMM (MTA18ASF1G72HZ, 8 GB) Datasheet'(PDF). Micron Technology. 2014-09-10. p. 18. Archived from the original(PDF) on 2014-11-29. Retrieved 2015-06-26.
8. ^Geof Findley; Becky Loop (2014-09-16). 'DDR4: The Right Memory for Your Next Server and High-End Desktop System'(PDF). intel.activeevents.com. Intel. p. 28. Archived from the original(PDF) on 2014-12-17. Retrieved 2015-06-26.
9. ^'How Intel Plans to Transition Between DDR3 and DDR4 for the Mainstream'. techpowerup.com. 2014-09-14. Retrieved 2015-06-26.
10. ^'DRAM – Can I mix DDR, DDR2 and DDR3 modules-my PC?'. integralmemory.com. Retrieved 2015-06-26.
11. ^micron.com - 200 Pin, PC2700 DDR SDRAM Unbuffered SO–DIMM REFERENCE DESIGN SPECIFICATIONArchived 2010-09-23 at the Wayback Machine page 26
12. ^'Corsair Memory — 4GB DDR3 SODIMM Memory (CM3X4GSD1066)'. corsair.com. Retrieved 1 October 2015.
13. ^'204-Pin DDR3 SDRAM Unbuffered SODIMM Design Specification'.
14. ^'Define-SO-CDIMM'. RAMpedia. Retrieved 2014-08-24.

External links[edit]

• Ruggedizing RAM for industrial systems (XR-DIMM form factor)

A DIMM or dual in-line memory module comprises a series of dynamic random-access memoryintegrated circuits. These modules are mounted on a printed circuit board and designed for use in personal computers, workstations and servers. DIMMs began to replace SIMMs (single in-line memory modules) as the predominant type of memory module as IntelP5-based Pentium processors began to gain market share.

While the contacts on SIMMs on both sides are redundant, DIMMs have separate electrical contacts on each side of the module. Another difference is that standard SIMMs have a 32-bit data path, while standard DIMMs have a 64-bit data path. Since Intel's Pentium, many processors have a 64-bit bus width, requiring SIMMs installed in matched pairs in order to populate the data bus. The processor would then access the two SIMMs in parallel. DIMMs were introduced to eliminate this disadvantage.

Variants[edit]

Variants of DIMM slots support DDR, DDR2, DDR3 and DDR4 RAM.

Common types of DIMMs include the following:

70 to 200 pins

• 72-pin SO-DIMM (not the same as a 72-pin SIMM), used for FPM DRAM and EDO DRAM
• 100-pin DIMM, used for printer SDRAM
• 144-pin SO-DIMM, used for SDR SDRAM (less frequently for DDR2 SDRAM)
• 168-pin DIMM, used for SDR SDRAM (less frequently for FPM/EDO DRAM in workstations/servers, may be 3.3 or 5 V)
• 172-pin MicroDIMM, used for DDR SDRAM
• 184-pin DIMM, used for DDR SDRAM
• 200-pin SO-DIMM, used for DDR SDRAM and DDR2 SDRAM
• 200-pin DIMM, used for FPM/EDO DRAM in some Sun workstations and servers.

201 to 300 pins

• 204-pin SO-DIMM, used for DDR3 SDRAM
• 214-pin MicroDIMM, used for DDR2 SDRAM
• 240-pin DIMM, used for DDR2 SDRAM, DDR3 SDRAM and FB-DIMM DRAM
• 244-pin MiniDIMM, used for DDR2 SDRAM
• 260-pin SO-DIMM, used for DDR4 SDRAM
• 260-pin SO-DIMM, with different notch position than on DDR4 SO-DIMMs, used for UniDIMMs that can carry either DDR3 or DDR4 SDRAM
• 278-pin DIMM, used for HP high density SDRAM.
• 288-pin DIMM, used for DDR4 SDRAM

168-pin SDRAM[edit]

On the bottom edge of 168-pin DIMMs there are two notches, and the location of each notch determines a particular feature of the module. The first notch is the DRAM key position, which represents RFU (reserved future use), registered, and unbuffered DIMM types (left, middle and right position, respectively). The second notch is the voltage key position, which represents 5.0 V, 3.3 V, and RFU DIMM types (order is the same as above).

DDR DIMMs[edit]

DDR, DDR2, DDR3 and DDR4 all have different pin counts, and different notch positions. As of August, 2014, DDR4 SDRAM is a modern emerging type of dynamic random access memory (DRAM) with a high-bandwidth ('double data rate') interface, and has been in use since 2013. It is the higher-speed successor to DDR, DDR2 and DDR3. DDR4 SDRAM is neither forward nor backward compatible with any earlier type of random access memory (RAM) because of different signalling voltages, timings, as well as other differing factors between the technologies and their implementation.

SPD EEPROM[edit]

A DIMM's capacity and other operational parameters may be identified with serial presence detect (SPD), an additional chip which contains information about the module type and timing for the memory controller to be configured correctly. The SPD EEPROM connects to the System Management Bus and may also contain thermal sensors (TS-on-DIMM).^[1]

Error correction[edit]

ECC DIMMs are those that have extra data bits which can be used by the system memory controller to detect and correct errors. There are numerous ECC schemes, but perhaps the most common is Single Error Correct, Double Error Detect (SECDED) which uses an extra byte per 64-bit word. ECC modules usually carry a multiple of 9 instead of a multiple of 8 chips.

Ranking[edit]

Sometimes memory modules are designed with two or more independent sets of DRAM chips connected to the same address and data buses; each such set is called a rank. Ranks that share the same slot, only one rank may be accessed at any given time; it is specified by activating the corresponding rank's chip select (CS) signal. The other ranks on the module are deactivated for the duration of the operation by having their corresponding CS signals deactivated. DIMMs are currently being commonly manufactured with up to four ranks per module. Consumer DIMM vendors have recently begun to distinguish between single and dual ranked DIMMs.

After a memory word is fetched, the memory is typically inaccessible for an extended period of time while the sense amplifiers are charged for access of the next cell. By interleaving the memory (e.g. cells 0, 4, 8, etc. are stored together in one rank), sequential memory accesses can be performed more rapidly because sense amplifiers have 3 cycles of idle time for recharging, between accesses.

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DIMMs are often referred to as 'single-sided' or 'double-sided' to describe whether the DRAM chips are located on one or both sides of the module's printed circuit board (PCB). However, these terms may cause confusion, as the physical layout of the chips does not necessarily relate to how they are logically organized or accessed.

JEDEC decided that the terms 'dual-sided', 'double-sided', or 'dual-banked' were not correct when applied to registered DIMMs (RDIMMs).

Organization[edit]

Most DIMMs are built using '×4' ('by four') or '×8' ('by eight') memory chips with nine chips per side; '×4' and '×8' refer to the data width of the DRAM chips in bits.

In the case of '×4' registered DIMMs, the data width per side is 36 bits; therefore, the memory controller (which requires 72 bits) needs to address both sides at the same time to read or write the data it needs. In this case, the two-sided module is single-ranked. For '×8' registered DIMMs, each side is 72 bits wide, so the memory controller only addresses one side at a time (the two-sided module is dual-ranked).

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The above example applies to ECC memory that stores 72 bits instead of the more common 64. There would also be one extra chip per group of eight, which is not counted.

Speeds[edit]

For various technologies, there are certain bus and device clock frequencies that are standardized; there is also a decided nomenclature for each of these speeds for each type.

DIMMs based on Single Data Rate (SDR) DRAM have the same bus frequency for data, address and control lines. DIMMs based on Double Data Rate (DDR) DRAM have data but not the strobe at double the rate of the clock; this is achieved by clocking on both the rising and falling edge of the data strobes. Power consumption and voltage gradually became lower with each generation of DDR-based DIMMs.

Ddr3 Vs Ddr4 Ram Memory

Form factors[edit]

Several form factors are commonly used in DIMMs. Single Data Rate Synchronous DRAM (SDR SDRAM) DIMMs were primarily manufactured in 1.5 inches (38 mm) and 1.7 inches (43 mm) heights. When 1U rackmount servers started becoming popular, these form factor registered DIMMs had to plug into angled DIMM sockets to fit in the 1.75 inches (44 mm) high box. To alleviate this issue, the next standards of DDR DIMMs were created with a 'low profile' (LP) height of around 1.2 inches (30 mm). These fit into vertical DIMM sockets for a 1U platform.

With the advent of blade servers, angled slots have once again become common in order to accommodate LP form factor DIMMs in these space-constrained boxes. This led to the development of the Very Low Profile (VLP) form factor DIMM with a height of around 0.72 inches (18 mm). The DDR3 JEDEC standard for VLP DIMM height is around 0.740 inches (18.8 mm). These will fit vertically in ATCA systems.

Ddr3 Ram In Ddr4 Slot

Full-height 240-pin DDR2 and DDR3 DIMMs are all specified at a height of around 1.18 inches (30 mm) by standards set by JEDEC. These form factors include 240-pin DIMM, SODIMM, Mini-DIMM and Micro-DIMM.^[2]

Full-height 288-pin DDR4 DIMMs are slightly taller than their DDR3 counterparts at 1.23 inches (31 mm). Similarly, VLP DDR4 DIMMs are also marginally taller than their DDR3 equivalent at nearly 0.74 inches (19 mm).^[3]

As of Q2 2017, Asus has had a PCI-E based 'DIMM.2', which has a similar socket to DDR3 DIMMs and is used to put in a module to connect up to two M.2NVMe solid-state drives. However, it cannot use common DDR type ram and does not have much support other than Asus.^{[citation needed]}

See also[edit]

• Dual in-line package (DIP)
• Memory geometry – logical configuration of RAM modules (channels, ranks, banks, etc.)
• NVDIMM – non-volatile DIMM
• Rambus in-line memory module (RIMM)
• Single in-line memory module (SIMM)
• Single in-line package (SIP)
• Zig-zag in-line package (ZIP)

References[edit]

Ddr3 Vs Ddr4 Ram Speed

1. ^Temperature Sensor in DIMM memory modules
2. ^JEDEC MO-269J Whitepaper., accessed Aug. 20, 2014.
3. ^JEDEC MO-309E Whitepaper., accessed Aug. 20, 2014.

External links[edit]

Use Ddr4 In Ddr3 Slot

Ddr3 To Ddr4